Lead arrangement for integrated circuits and method of assembly

Details Lead arrangement for integrated circuits and method of assembly Lead arrangement for integrated circuits and method of assembly

1992-09-16

1994-05-03

Echols, P.W.

Special receptacle or package

For a vehicle

29827, 29843, 29884, 206330, 228212, H01R 922, B65D 7302

Patent

active

053079299

ABSTRACT:
A lead arrangement is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining means are also provided integral with the lead arrangement to hold the substrate against the leads, as during soldering. The retaining means may be disengaged from the substrate separately or simultaneously with the trimming of the leads from the lead arrangement after connecting to the substrate.

REFERENCES:
patent: 2830698 (1958-04-01), Goda et al.
patent: 3702954 (1972-11-01), Mosch et al.
patent: 3908075 (1975-09-01), Jackson et al.
patent: 4054238 (1977-10-01), Lloyd et al.
patent: 4728589 (1988-11-01), Dennis

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