Lead- and antimony-free solder composition

Details Lead- and antimony-free solder composition Lead- and antimony-free solder composition

1989-04-19

1989-11-07

McDowell, Robert

Alloys or metallic compositions

Tin base

Copper containing

22826311, C22C 1300

Patent

active

048790966

ABSTRACT:
Lead-free and antimony-free solder compositions are described which comprise, as essential ingredients, about 0.05% to about 3% by weight of silver; about 0.5% to about 6% by weight of copper; about 0.1% to about 3% by weight of bismuth; and about 88% to about 99.35% by weight of tin. In preferred embodiments, the solders are also essentially free of cadmium and may also be essentially free of both cadmium and zinc.

REFERENCES:
patent: 1437641 (1922-12-01), Ferriere et al.
patent: 3607253 (1971-09-01), Cain
patent: 4670217 (1987-06-01), Henson et al.
patent: 4695428 (1987-09-01), Ballentine et al.
patent: 4758407 (1988-07-01), Ballentine et al.
patent: 4778733 (1988-10-01), Lubrano et al.
patent: 4806309 (1989-02-01), Tulman

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