LCD device having test contact pads

Liquid crystal cells – elements and systems – Particular structure – Having significant detail of cell structure only

Reexamination Certificate

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Details

C349S149000, C349S151000, C349S192000, C324S701000

Reexamination Certificate

active

06930744

ABSTRACT:
To make the test probe not directly in contact with the electrode pads for the semiconductor chip mounting, without using an advanced technology for making the pitch of electrode pads narrower, and remove the chip mounting failures such as scratching of electrode pads caused by testing, adherence of impurity particles, electrical corrosion.The electrode pads13formed on the distal ends of the external leads5for press-connecting the input electrodes12of the semiconductor chip6are disposed at both sides (shown as L1) of the semiconductor chip6. The terminal-electrode leads2from the electrode pads3pass under the semiconductor chip6while keeping a pitch of the electrode pads3. The test electrode pads4are disposed in alternate arrangement on the distal ends of terminal-electrode leads2. The test electrode pads4may be disposed in alternate arrangement in three steps or more of multiple steps.

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patent: 5712493 (1998-01-01), Mori et al.
patent: 5742074 (1998-04-01), Takizawa et al.
patent: 6025891 (2000-02-01), Kim
patent: 6043971 (2000-03-01), Song et al.
patent: 6059624 (2000-05-01), Dehaine et al.
patent: 3-29925 (1991-02-01), None
patent: 6-110072 (1994-04-01), None
patent: 07-092478 (1995-04-01), None
patent: 11-202353 (1999-07-01), None
patent: 2000-137239 (2000-05-01), None
patent: 2000-321591 (2000-11-01), None

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