LCC co-planar lead frame semiconductor IC package

Details LCC co-planar lead frame semiconductor IC package LCC co-planar lead frame semiconductor IC package

1984-01-04

1985-09-24

Gensler, Paul

Wave transmission lines and networks

Coupling networks

With impedance matching

333238, H01P 508

Patent

active

045435448

ABSTRACT:
An apparatus and method is disclosed for allowing faster and higher fidelity signals to be transmitted from a PC board to an IC by maintaining a constant impedance from the PC board to the IC. A leadless chip connector is used with a ground plane mounted co-planar to the conductor. As the conductor and ground planes extend toward the IC they decrease in width and the distance between the conductor and ground plane varies to maintain a constant impedance.

REFERENCES:
patent: 3419813 (1968-12-01), Kamnitsis
patent: 3621367 (1971-11-01), Rosen et al.
patent: 3895435 (1975-07-01), Turner et al.
patent: 4047132 (1977-09-01), Krajewski
patent: 4186358 (1980-01-01), Czech et al.
patent: 4460880 (1984-07-01), Turner
patent: 4479100 (1984-10-01), Moghe et al.

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