Layout structures and methods of fabricating layout structures

Static information storage and retrieval – Interconnection arrangements

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C365S051000, C365S203000, C365S205000

Reexamination Certificate

active

07660141

ABSTRACT:
Example embodiments may provide a layout structure and layout method for a memory device that may reduce the area of the memory device. Example embodiment layout structures may include a first region and/or a second region. First and second sensing MOS transistors of a sense amplifier that senses data of a bit line and a complementary bit line may be arranged in the first region. First, second and third equalization MOS transistors of an equalizer that equalizes the bit line and the complementary bit line may be arranged In the second region located apart from the first region, Sensing NMOS transistors and equalization NMOS transistors may share an N-type active region in the layout structure of a memory device, and the area of a sense amplifier may be reduced.

REFERENCES:
patent: 6262922 (2001-07-01), Nakamura et al.
patent: 6721221 (2004-04-01), Schreck
patent: 7138684 (2006-11-01), Hidaka et al.
patent: 7184330 (2007-02-01), Tajima et al.
patent: 06-140592 (1994-05-01), None
patent: 2004-0041097 (2004-05-01), None
Office Action for corresponding Korean Application No. 10-2006-096132 dated Aug. 31, 2007.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Layout structures and methods of fabricating layout structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Layout structures and methods of fabricating layout structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Layout structures and methods of fabricating layout structures will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4220266

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.