Layout of a printed circuit board

Details Layout of a printed circuit board Layout of a printed circuit board

2006-08-21

2009-11-10

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

07615706

ABSTRACT:
A layout of a printed circuit board adaptive to be bonded to an integrated circuit device is introduced here. The layout includes a first metal layer, disposed in a first insulation layer and a second metal layer, disposed in a second insulation layer over the first insulation layer. The first metal layer and the second metal layer are connected to each other through a plurality of contact hole filled with conductive materials and are arranged to be substantially parallel to each other throughout a pad structure region and a line structure region of the printed circuit. The connected first metal layer and second metal layer are used for a signal path from the printed circuit board to the bonded integrated circuit device to improve driving ability of power supply.

REFERENCES:
patent: 5339217 (1994-08-01), Cohen et al.
patent: 6903369 (2005-06-01), Chen et al.
patent: 2004/0051829 (2004-03-01), Ishihara et al.
patent: 2004/0084761 (2004-05-01), Karthikeyan et al.
patent: 2005/0124093 (2005-06-01), Yang et al.
patent: 2532661 (2003-01-01), None

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