Layout and use of bond pads and probe pads for testing of...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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07061263

ABSTRACT:
An integrated circuit die comprising functional circuitry, a plurality of bond pads, each bond pad associated with a respective portion of the functional circuitry and for bonding the respective portion of the functional circuitry, at least one probe pad for testing of the functional circuitry; and multiplexing circuitry between the probe pad and the bond pads, the multiplexing circuitry for multiplexing signals between the probe pad and each of the respective portions of the functional circuitry, thus allowing the respective portions of functional circuitry to be tested using the probe pad and without any contact of the plurality of bond pads by a probe needle.

REFERENCES:
patent: 4743841 (1988-05-01), Takeuchi
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5418452 (1995-05-01), Pyle
patent: 5457400 (1995-10-01), Ahmad et al.
patent: 5477545 (1995-12-01), Huang
patent: 5479105 (1995-12-01), Kim et al.
patent: 5506499 (1996-04-01), Puar
patent: 5523697 (1996-06-01), Farnworth et al.
patent: 5604432 (1997-02-01), Moore et al.
patent: 5619461 (1997-04-01), Roohparvar
patent: 5657284 (1997-08-01), Beffa
patent: 5677885 (1997-10-01), Roohparvar
patent: 5751015 (1998-05-01), Corbett et al.
patent: 5751987 (1998-05-01), Mahant-Shetti et al.
patent: 5801452 (1998-09-01), Farnworth et al.
patent: 5805609 (1998-09-01), Mote, Jr.
patent: 5807762 (1998-09-01), Akram et al.
patent: 5825697 (1998-10-01), Gilliam et al.
patent: 5825782 (1998-10-01), Roohparvar
patent: 5923600 (1999-07-01), Momohara
patent: 5925142 (1999-07-01), Raad et al.
patent: 5936260 (1999-08-01), Corbett et al.
patent: 5959310 (1999-09-01), Akram et al.
patent: 5966388 (1999-10-01), Wright et al.
patent: 6026039 (2000-02-01), Kim et al.
patent: 6072326 (2000-06-01), Akram et al.
patent: 6087676 (2000-07-01), Akram et al.
patent: 6100708 (2000-08-01), Mizuta
patent: 6104658 (2000-08-01), Lu
patent: 6137167 (2000-10-01), Ahn et al.
patent: 6154860 (2000-11-01), Wright et al.
patent: 6157046 (2000-12-01), Corbett et al.
patent: 6188232 (2001-02-01), Akram et al.
patent: 6191603 (2001-02-01), Muradali et al.
patent: 6194738 (2001-02-01), Debenham et al.
patent: 6208157 (2001-03-01), Akram et al.
patent: 6216241 (2001-04-01), Fenstermaker et al.
patent: 6243839 (2001-06-01), Roohparvar
patent: 6243840 (2001-06-01), Raad et al.
patent: 6274937 (2001-08-01), Ahn et al.
patent: 6286115 (2001-09-01), Stubbs
patent: 6294839 (2001-09-01), Mess et al.
patent: 6298001 (2001-10-01), Lee et al.
patent: 6300782 (2001-10-01), Hembree et al.
patent: 6310484 (2001-10-01), Akram et al.
patent: 6320201 (2001-11-01), Corbett et al.
patent: RE37611 (2002-03-01), Roohparvar
patent: 6365421 (2002-04-01), Debenham et al.
patent: 6366487 (2002-04-01), Yeom
patent: 6392948 (2002-05-01), Lee
patent: 6395565 (2002-05-01), Akram et al.
patent: 6396291 (2002-05-01), Akram et al.
patent: 6407566 (2002-06-01), Brunelle et al.
patent: 6441479 (2002-08-01), Ahn et al.
patent: 6445625 (2002-09-01), Abedifard
patent: 6456099 (2002-09-01), Eldridge et al.
patent: 6470484 (2002-10-01), Day et al.
patent: 6483760 (2002-11-01), Kang
patent: 6484279 (2002-11-01), Akram
patent: 6502215 (2002-12-01), Raad et al.
patent: 6507885 (2003-01-01), Lakhani et al.
patent: 6519725 (2003-02-01), Huisman et al.

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