Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-01-09
2007-01-09
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C451S533000, C451S538000
Reexamination Certificate
active
10754381
ABSTRACT:
A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.
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Castillo Margarita
Kodaka Ichiro
Miller Claughton
Sischile Charles
Timbang Alvin
Aftergut Jeff H.
Goff John L.
Mipox International Corporation
Sheppard Mullin Richter & Hampton LLP
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