Layered structure with printed elements

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S792000, C361S793000, C361S794000, C361S795000, C174S259000, C174S260000, C174S261000, C174S262000, C428S209000, C428S210000

Reexamination Certificate

active

07599192

ABSTRACT:
The present invention incorporates electronic components into an electronic core structure that may be readily hot laminated by existing processes. The structure may include multiple desired electronic components, such as a display, battery or other power source, integrated circuits, switches, magnetic stripe emulator, antenna, smart chips or other input devices. The structure includes laminated buffer layers to bridge layers and compensate for variation in electronic component dimensions. The structure may also incorporate battery packaging as part of the core layer structure and use printed electronic circuitry as part of the electronic core layers to impart the desired characteristics. A variety of components may be incorporated in the structure.

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