Layered structure for adhering gold to a substrate and method of

Details Layered structure for adhering gold to a substrate and method of Layered structure for adhering gold to a substrate and method of

1989-02-17

1990-02-06

Herbert, Thomas J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

428336, 428457, 428472, 428698, 428699, B32B 702, B32B 1504

Patent

active

048987689

ABSTRACT:
A layered structure for adhering gold to a substrate and a method of forming such on a substrate are disclosed. An article of jewelry or the like which is formed by the disclosed method and which includes the disclosed layered structure is also disclosed. The layered structure includes a first layer overlying the substrate. The first layer includes a member selected from the group consisting of metal nitrides, metal carbides and metal carbonitrides wherein the metal is selected from the group consisting of titanium, zirconium and hafnium. The layered structure also includes a transparent layer of refractory metal which overlies the first layer and underlies the gold or alloy thereof. The disclosed method includes forming the aforementioned first layer over the substrate and then forming the transparent layer of refractory metal on the first layer. Both the first layer and transparent layer are preferably formed or deposited on the substrate by a cathodic arc plasma deposition process. The method also includes forming a top layer of gold or an alloy thereof on the transparent layer, which gold layer is preferably formed or deposited by a magnetron sputtering process. The article of jewelry or the like includes a substrate and a multi-layered coating which can be formed on the substrate by the disclosed method.

REFERENCES:
patent: 4252862 (1981-02-01), Nishida
patent: 4333962 (1982-06-01), Pulker et al.
patent: 4403014 (1983-09-01), Bergmann
patent: 4591418 (1986-05-01), Snyder
patent: 4753851 (1988-06-01), Roberts et al.

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