Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Reexamination Certificate
2001-11-27
2004-12-07
Dinkins, Anthony (Department: 2831)
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
C361S313000, C361S321200, C029S029000
Reexamination Certificate
active
06829135
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a layered product of resin thin films and metal thin films, as well as a capacitor and an electronic component including such a layered product. Furthermore, the present invention relates to a suitable method and apparatus for manufacturing the same.
BACKGROUND ART
A method for manufacturing a layered product by taking a step of layering a resin thin film and a step of layering a metal thin film as one unit and repeating this unit of steps with respect to a rotating carrier, as well as a method for obtaining an electronic component such as a capacitor from the resulting layered product, are known for example from the Publication of Unexamined Japanese Patent Application (Tokkai) JP H10-237623A.
Referring to the accompanying drawings, the following is an explanation of an example of a method for manufacturing such a layered product of resin thin films and metal thin films.
FIG. 22
is a cross-sectional view schematically illustrating an example of a manufacturing apparatus for practicing a conventional method for manufacturing a layered product.
In
FIG. 22
, numeral
915
denotes a vacuum container, numeral
916
denotes a vacuum pump for sustaining a predetermined vacuum level inside the vacuum container
915
. Numeral
911
denotes a cylindrical can roller arranged inside the vacuum container
915
and rotating in the direction of the arrow in FIG.
22
. Numeral
912
denotes a resin thin film formation device. Numeral
913
denotes a patterning material application devices, and numeral
914
denotes a metal thin film formation device. Numeral
917
denotes a patterning material removing device. Numeral
918
denotes a resin curing device, and numeral
919
denotes a surface processing device. Numerals
920
a
and
920
b
denote partition walls for partitioning the metal thin film formation region from the other regions. Numeral
922
denotes an aperture provided in the partition walls
920
a
and
920
b
, and numeral
923
denotes a shielding plate for preventing the metal thin film from being formed outside the necessary times.
The resin thin film formation device
912
heats and gasifies or atomizes resin material for forming a resin thin film, and ejects the resin material toward the outer peripheral surface of the can roller
911
. Because the can roller
911
is cooled to a predetermined temperature, the resin material cools and is deposited as a film on the outer peripheral surface of the can roller
911
.
If necessary, the deposited thin film is cured to a desired curing degree by irradiating an electron beam or UV light or the like with the resin curing device
918
.
Then, the formed resin thin film is plasma processed with a surface processing device
919
to activate the resin thin film surface, if necessary.
The patterning material application device
913
patterns metal thin film into a predetermined shape by forming margins (also referred to as “non-metallic bands” in the following in the metal thin films by so-called oil patterning. When a metal thin film is formed, for example by vapor deposition after forming a patterning material thinly on the resin thin film, the metal thin film is not formed on the patterning material, thus forming margins. The metal thin film formed in this manner is thus formed with the patterning portions missing, so that a metal thin film having the desired pattern can be formed. The pattern material is gasified inside the patterning material application device
913
, and ejected from micro-holes formed at a predetermined position in opposition to the outer peripheral A surface of the can roller
911
. A plurality of micro-holes are usually arranged at a predetermined spacing substantially in parallel to the rotation axis of the can roller
911
. The plurality of bands of patterning material is applied thinly on the surface before forming the metal thin film.
Then, a metal thin film is formed, for example by vapor deposition, with the metal thin film formation device
914
.
After that, excess patterning material is removed with the patterning material removing device
917
.
When the shielding plate
923
of this manufacturing apparatus
900
is shifted to the side to open the aperture
922
, a layered product is manufactured in which resin thin films formed with the resin thin film formation device
912
are layered in alternation with metal thin films formed with the metal thin film device
914
on the outer peripheral surface of the rotating can roller
911
. Furthermore, when the shielding plate
923
of this manufacturing apparatus
900
closes the aperture
922
, a layered product is manufactured in which resin thin films are formed continuously on the outer peripheral surface of the rotating can roller
911
with the resin thin film formation device
912
. In addition, metal thin films with differing margin positions can be formed by shifting the patterning material application device
913
(for example, back and forth) in a direction parallel to the rotation axis of the can roller
911
, in synchronization with the rotation of the can roller
911
.
In this manner, a cylindrical multi-layer layered product of metal thin films and resin thin films is formed on the outer peripheral surface of the can roller
911
, which then can be retrieved from the can roller
911
by cutting it in a radial direction, and pressing it flat to obtain a laminate base element
930
, as shown for example in FIG.
23
. In
FIG. 23
, numeral
931
denotes the resin thin films, numeral
932
denotes the metal thin films, numeral
933
denotes the margins (that is, the regions where no metal thin film is formed), and arrow
938
denotes the travel direction of the outer peripheral surface of the can roller
911
. The laminate base element
930
in
FIG. 23
is manufactured by layering a layer
936
a
, a layer
935
a
, a layer
934
, a layer
935
b
, and a layer
936
b
in that order on a can roller
911
. Here, the layers
936
a
and
936
b
are formed by shutting the shielding plate
923
and continuously layering resin thin film only, and the layers
934
,
935
a
and
935
b
are formed by opening the shielding plate
923
and layering metal thin films
931
and resin thin films
932
in alternation. Furthermore, the layer
934
is layered while modifying the position at which patterning material is adhered once per rotation of the can roller
911
.
A plurality of chip capacitors
940
as shown in
FIG. 24
can be obtained by cutting the laminate base element
930
for example along the cutting planes
939
a
and
939
b
, and forming external electrodes on the cutting planes
939
a
. In
FIG. 24
, the numerals
941
a
and
941
b
denote external electrodes that are electrically connected to the metal thin films
931
.
In the capacitor obtained with this method, the thickness of the resin thin films serving as the dielectric layer can be made extremely thin, so that a small capacitor with a large capacitance is obtained.
However, the following problems occur when manufacturing electronic components, such as capacitors, with the above-described method.
First of all, when the laminate base element
930
is cut at the cutting planes
939
a
and
939
b
, it is necessary to cut through the metal thin films
931
as well. The cutting is performed by shearing with a blade, for example, and burrs or metal chips of the metal thin films
931
are produced at the cutting planes. Because the resin thin films and metal thin films obtained with this method are extremely thin, the burrs or cutting chips of the metal thin films
931
may cause short circuits between the metal thin films on the upper and lower side of a resin thin film. This may lead to a decrease in the withstand voltage or the insulation resistance of the resulting capacitor.
Furthermore, to cut the metal thin films, a cutting force is necessary that is much larger than that for cutting the resin thin films. Consequently, when the cutting conditions are not appropriate, the layered product may be deformed near the cutting planes or the metal thin films
Echigo Noriyasu
Honda Kazuyoshi
Kai Yoshiaki
Odagiri Masaru
Sunagare Nobuki
Dinkins Anthony
Matsushita Electric - Industrial Co., Ltd.
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