Layered board and electronic apparatus having the layered board

Details Layered board and electronic apparatus having the layered board Layered board and electronic apparatus having the layered board

2008-07-01

2008-07-01

Lam, Cathy F. (Department: 1794)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S192000, C174S250000, C174S255000, C361S736000, C361S742000

Reexamination Certificate

active

07393580

ABSTRACT:
A layered board is disclosed which can avoid the occurrence of cracks in a core layer due to shearing stress caused by a difference in coefficient of thermal expansion between the core layer and a buildup layer. The layered board includes a core layer which serves as a printed board, a buildup layer which includes an insulation part and a wiring part, is overlaid on the core layer, and is electrically connected to the core layer, and an edge layer formed at least at an edge on the periphery of the core layer, the edge layer being different from the core layer. Alternatively, the core layer projects outward from an edge on the periphery of the buildup layer.

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patent: 6207904 (2001-03-01), Kramer et al.
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patent: 6734541 (2004-05-01), Shimoe et al.
patent: 10-144504 (1998-05-01), None
patent: 11-112114 (1999-04-01), None
patent: 2003-7962 (2003-01-01), None

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