Layer system comprising a silicon layer and a passivation...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S513000, C257S622000, C257S626000, C257S647000, C257SE23002, C257SE21546, C438S437000, C438S719000, C438S958000

Reexamination Certificate

active

07872333

ABSTRACT:
A layer system is described including a silicon layer and a passivation layer which is applied at least regionally to the silicon layer's surface, the passivation layer having a first, at least largely inorganic partial layer and a second partial layer, the second partial layer being made of an organic compound including silicon or containing such a material. In particular, the second partial layer is structured in the form of a “self-assembled monolayer.” Furthermore, a method is described for creating a passivation layer on a silicon layer, a first, inorganic partial layer being created on the silicon layer and a second partial layer, containing an organic compound including silicon or being made thereof, being created at least in certain areas on the first partial layer. Both partial layers form the passivation layer. The described layer system or the described method is particularly suited for creating self-supporting structures in silicon.

REFERENCES:
patent: 5233181 (1993-08-01), Kwansnick et al.
patent: 5604380 (1997-02-01), Nishimura et al.
patent: 5646439 (1997-07-01), Mori et al.
patent: 5932485 (1999-08-01), Schofield
patent: 6258407 (2001-07-01), Lee et al.
patent: 6323131 (2001-11-01), Obeng et al.
patent: 6383920 (2002-05-01), Wang et al.
patent: 6387819 (2002-05-01), Yu
patent: 7229910 (2007-06-01), Usami
patent: 7642545 (2010-01-01), Urban et al.
patent: 2002/0140103 (2002-10-01), Kloster et al.
patent: 2002/0158339 (2002-10-01), Yamamoto
patent: 2003/0013272 (2003-01-01), Hong et al.
patent: 2005/0074919 (2005-04-01), Patel et al.
patent: 2006/0068510 (2006-03-01), Urban et al.
patent: 2006/0108576 (2006-05-01), Laermer et al.
patent: 42 41 045 (1992-12-01), None
patent: 44 20 962 (1995-12-01), None
patent: 197 06 682 (1998-08-01), None
patent: 198 47 455 (2000-04-01), None
patent: 0 822 586 (1998-02-01), None
patent: 0822586 (1998-02-01), None
patent: 5-217961 (1993-08-01), None
patent: 7-106328 (1995-04-01), None
patent: 7106328 (1995-04-01), None
patent: 07-095306 (1996-11-01), None
patent: 9-82704 (1997-03-01), None
patent: 10-74755 (1998-03-01), None
patent: 10074755 (1998-03-01), None
patent: WO 00/023376 (2000-04-01), None
patent: WO 02/05349 (2002-01-01), None
Furuya et al. Fluorinated polyimide fabrication by magnetically controlled reactive ion etching (MC RIE). 1994. J. Micromech. Microeng. vol. 4, pp. 67-73.
Tetsuya Homma. Fluorinated interlayer dielectric films in ULSI multilevel interconnections. 1995. Journal of Non-Crystalline Solids. 187. pp. 49-59.
Nguyen Nhu, Toan. Spin-On Glass Materials and Applications in Advanced IC Technologies. 1999. Thesis. Retrieved from the Internet<URL:http://doc.utwente.n1/14094/>.
Homma et al. Stability of a new polyimide siloxane film as interlayer dielectrics of ULSI multilevel interconnections. Nov. 25, 1993. Thin Solid Films. vol. 235, Issues 1-2, pp. 80-85. Provided is abstract thereof.
Homma et al. Electrical stability of polyimide siloxane films for interlayer dielectrics in multilevel interconnections. 1999. Thin Solid Films. vol. 340, pp. 237-241.
T. Homma, “Fluorinated interlayer dielectric films in ULSI multilevel interconnections”, Journal of Non-Crystalline Solids, 1995, 187, pp. 49-59.
T. Homma, “Stability of a new polyimide siloxane film as interlayer dielectrics of ULSI multilevel interconnections”, Thin Solid Films, Nov. 25, 1993, vol. 235, Issues 1-2, pp. 80-85. Provided is abstract thereof.
T. Homma, “Electrical stability of polyimide siloxane films for interlayer dielectrics in multilevel interconnections”, Thin Solid Films, 1999, vol. 340, pp. 237-241.
Nguyen Nhu Toan, “Spin-on-glass materials and applications in advanced IC technologies”, 1999, retrieved from the Internet, URL:http://doc.utwente.nl/1409/.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Layer system comprising a silicon layer and a passivation... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Layer system comprising a silicon layer and a passivation..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Layer system comprising a silicon layer and a passivation... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2713253

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.