Layer system, and process for producing a layer system

Details Layer system, and process for producing a layer system Layer system, and process for producing a layer system

2007-02-27

2007-02-27

Look, Edward K. (Department: 3745)

Fluid reaction surfaces (i.e., impellers)

Specific blade structure

Laminated, embedded member or encased material

C416S24100B

Reexamination Certificate

active

10957438

ABSTRACT:
On account of their form of coating, layer systems according to the prior art often only have a low level of attachment to the substrate. The layer may then become detached in the event of high mechanical loads being applied to the components. The layer system according to the invention has separately produced anchoring means which are more strongly attached to the substrate than the attachment of the layer to the substrate.

REFERENCES:
patent: 5869798 (1999-02-01), Ryu et al.
patent: 5900102 (1999-05-01), Reeves
patent: 6015630 (2000-01-01), Padture et al.
patent: 6306517 (2001-10-01), Gray et al.
patent: 6398503 (2002-06-01), Takahashi et al.
patent: 6720087 (2004-04-01), Fried et al.
patent: 2002/0146584 (2002-10-01), Fried
patent: 30 38 416 (1981-08-01), None
patent: 100 57 187 (2002-05-01), None
patent: 0 713 957 (1996-05-01), None
patent: 1 275 748 (2003-01-01), None
Anthony J. Pedraza, Mukund J. Godbole, Douglas H. Lowndes, James R. Thompson, Jr., “Enhanced metal-ceramic adhesion by sequential sputter deposition and pulsed laser melting of copper films on sapphire substrates”, Journal of Materials Science, Jan. 1989, pp. 115-123, No. 1, London, GB.

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