Layer sequence built on a substrate in thin-film technology

Details Layer sequence built on a substrate in thin-film technology Layer sequence built on a substrate in thin-film technology

2006-03-28

2006-03-28

Zimmerman, John J. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Having variation in thickness

C428S636000, C428S614000, C428S673000, C428S935000, C428S938000

Reexamination Certificate

active

07018720

ABSTRACT:
The layer sequence built on a substrate in thin-film technology includes an electrically conductive sputtered layer and an electrically conductive reinforcing layer for reinforcing or strengthening the sputtered layer, which is applied on the sputtered layer by a method other than sputtering. In order to remove conducting material from the conductive layers with the aid of a laser for the purposes of adjustment while producing as little contaminating material as possible, the electrically conductive reinforcing layer has a reduced thickness or is completely eliminated in regions of the electrically conductive layers to be adjusted than in other regions outside of the regions to be adjusted.

REFERENCES:
patent: 3556951 (1971-01-01), Cerniglia
patent: 4005456 (1977-01-01), Botzenhardt
patent: 4357395 (1982-11-01), Lifshin et al.
patent: 5015338 (1991-05-01), Tabuchi et al.
patent: 5167776 (1992-12-01), Bhaskar
patent: 5349500 (1994-09-01), Casson et al.
patent: 5454904 (1995-10-01), Ghezzo et al.
patent: 198 21 382 (1999-11-01), None
Lasertrim Capacitors, Johanson Technology, Camarillo, CA, USA., pp. 1-23 (no date).

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