Layer having functionality, method for forming flexible...

Details Layer having functionality, method for forming flexible... Layer having functionality, method for forming flexible...

2006-11-03

2009-12-15

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S759000, C438S149000, C257SE21372, C257SE21104, C257SE21411

Reexamination Certificate

active

07632740

ABSTRACT:
It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.

REFERENCES:
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5834327 (1998-11-01), Yamazaki et al.
patent: 6376333 (2002-04-01), Yamazaki et al.
patent: 6866949 (2005-03-01), Ota et al.
patent: 6998282 (2006-02-01), Yamazaki et al.
patent: 7189631 (2007-03-01), Yamazaki et al.
patent: 07-157727 (1995-06-01), None
patent: 2003-136628 (2003-05-01), None
patent: 2004-310502 (2004-11-01), None
International Search Report (Application No. PCT/JP2006/321928) Dated Feb. 6, 2007.
Written Opinion (Application No. PCT/JP2006/321928) Dated Feb. 6, 2007.

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