Layer forming material and wiring forming method

Details Layer forming material and wiring forming method Layer forming material and wiring forming method

1996-03-19

1998-06-30

Baxter, Janet G.

Organic compounds -- part of the class 532-570 series

Organic compounds

Heavy metal containing

556426, 556430, 427250, 430320, 430315, C07F 108, C23C 1600

Patent

active

057736391

ABSTRACT:
A layer forming material is a compound which has a structure of six-membered ring coordinated to Cu and containing Si, and of which general formula is represented by the following chemical formula: ##STR1## wherein X.sub.1 and X.sub.2 are elements of the VI group of the same or different types which are coordinate-bonded to Cu, and of which examples include O, S, Se, Te and the like, at least one of Y.sub.1, Y.sub.2 and Y.sub.3 is Si, L is a group which has a double or triple bond and which is able to supply electrons to Cu, and each of R.sub.1 and R.sub.2 is any of SiF.sub.3, SiH.sub.3, CF.sub.3 and CH.sub.3 for example.

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Schmidt, G. et al. "Organomettalic Compounds of Copper, X", J.Organomet.Chem., 1996, 509(1),pp. 49-55.
Jain, A. et al, "Chemical Vapor Deposition of Copper from (Hexafluoroacetylacetonato)(alkyne)Copper(I) Complexes via Disproprotionation", Chem. Mat., 1991, 3, pp. 995-997.

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