Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2009-07-02
2011-10-25
Sellers, Robert (Department: 1765)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C174S259000, C523S206000, C523S428000, C523S429000, C523S434000, C525S486000, C525S524000
Reexamination Certificate
active
08044154
ABSTRACT:
Disclosed herein is a curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct. Additionally disclosed is a process comprising agitating a solution of an amine, an epoxy resin, and an elastomer-epoxy adduct as a dispersant at an elevated temperature in an organic medium.
REFERENCES:
patent: 2795572 (1957-06-01), Muller
patent: 4123450 (1978-10-01), Weber
patent: 4647631 (1987-03-01), Noguchi et al.
patent: 4833226 (1989-05-01), Ishimura et al.
patent: 5212044 (1993-05-01), Liang
patent: 5219956 (1993-06-01), Fukuoka
patent: 5357008 (1994-10-01), Tsai et al.
patent: 5480957 (1996-01-01), Muroi et al.
patent: 5543516 (1996-08-01), Ishida
patent: 5548058 (1996-08-01), Muroi et al.
patent: 5554714 (1996-09-01), Muroi et al.
patent: 5561204 (1996-10-01), Muroi et al.
patent: 5567792 (1996-10-01), Muroi et al.
patent: 5591814 (1997-01-01), Muroi et al.
patent: 5843251 (1998-12-01), Tsukagoshi et al.
patent: 5880229 (1999-03-01), Kokura et al.
patent: 6207786 (2001-03-01), Ishida
patent: 6225440 (2001-05-01), Ishida
patent: 6328844 (2001-12-01), Watanabe et al.
patent: 6437026 (2002-08-01), Garrett
patent: 6743852 (2004-06-01), Dershem
patent: 6846559 (2005-01-01), Czaplicki et al.
patent: 6899960 (2005-05-01), Shi
patent: 7179684 (2007-02-01), Shi
patent: 7438782 (2008-10-01), Sheasley et al.
patent: 7847026 (2010-12-01), Bertsch et al.
patent: 2002/0038041 (2002-03-01), Clements et al.
patent: 2004/0204551 (2004-10-01), Czaplicki et al.
patent: 2006/0128835 (2006-06-01), Usui et al.
patent: 2006/0210805 (2006-09-01), Mizuno
patent: 2006/0280912 (2006-12-01), Liang et al.
patent: 2007/0010636 (2007-01-01), Kamiya et al.
patent: 2007/0055039 (2007-03-01), Usui et al.
patent: 2007/0088039 (2007-04-01), Balog et al.
patent: 2007/0095475 (2007-05-01), Hable et al.
patent: 2007/0212551 (2007-09-01), Collins
patent: 2007/0244268 (2007-10-01), Usui et al.
patent: 2007/0270515 (2007-11-01), Chmielewski et al.
patent: 2008/0090943 (2008-04-01), Xu et al.
patent: 2008/0188609 (2008-08-01), Agarwal et al.
patent: 2008/0249257 (2008-10-01), Masuko et al.
patent: 2008/0249258 (2008-10-01), Masuko et al.
patent: 2008/0251757 (2008-10-01), Yamamoto et al.
patent: 2008/0308212 (2008-12-01), Sheasley et al.
patent: 2009/0181165 (2009-07-01), Liang et al.
patent: 0459745 (1991-12-01), None
patent: 0552976 (1993-07-01), None
patent: 1557438 (2005-07-01), None
patent: 1731545 (2006-12-01), None
patent: 1852452 (2007-11-01), None
patent: 1980580 (2008-10-01), None
Derwent accession No. 2004-735065 for Russian Patent No. 2,228,346, Bogmolova et al., May 10, 2004, one page.
Derwent accession No. 2009-E74443 for Korean Patent No. 2008-102823, DAE, Nov. 26, 2008, two pages.
Heise, M.S. et al., “Mechanism of 2-Ethyl-4-methylimidazole in the Curing of the Diglycidyl Ether of Bisphenol A,”Journal of Polymer Science: Part C: Polymer Letters, vol. 26, pp. 153-157.
Heise, M.S. et al., “Curing Mechanism and Thermal Properties of Epoxy-Imidazole Systems,”Macromolecules, vol. 22, No. 1, pp. 99-104 (1989).
Colclaser, Roy A.,Microelectronics: Processing and Device Design, Chapter 8, pp. 163-182, John Wiley & Sons (1980).
Barton, J.M. et al., “The Curing Reaction of an Epoxide Resin with 2-Ethyl-4-methylimidazole, a Calorimetric Study of the Kinetics of Formation of Epoxide-Imidazole Adducts,”Die Makromolekulare Chemie, 176, pp. 919-930 (1975).
Heise, M.S. et al., “Mechanism of 2-Ethyl-4-methylimidazole in the Curing of the Diglycidyl Ether of Bisphenol A,”Journal of Polymer Science: Part C: Polymer Letters, vol. 26, pp. 153-157 (1988).
Shriner et al.,The Systematic Identification of Organic Compounds, 1980, pp. 348-350, 6th Ed., John Wiley & Sons, USA.
Petrie,Epoxy Adhesive Formulations, 2006, pp. 126-127, 136, McGraw-Hill Publishers, USA.
Liang Rong-Chang
McNamara John J.
Ying Yurong
Sellers Robert
Thompson Hine LLP
Trillion Science, Inc.
LandOfFree
Latent hardener for epoxy compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Latent hardener for epoxy compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Latent hardener for epoxy compositions will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4265078