Latching micro magnetic relay packages and methods of packaging

Details Latching micro magnetic relay packages and methods of packaging Latching micro magnetic relay packages and methods of packaging

2006-12-19

2006-12-19

Nguyen, Tuyen T (Department: 2832)

Electricity: magnetically operated switches, magnets, and electr

Electromagnetically actuated switches

Polarity-responsive

C335S080000, C200S181000

Reexamination Certificate

active

07151426

ABSTRACT:
A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.

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