Laser ultrasonics-based material analysis system and method

Details Laser ultrasonics-based material analysis system and method Laser ultrasonics-based material analysis system and method

1997-02-14

1998-07-14

Nelms, David C.

Optics: measuring and testing

For light transmission or absorption

356359, 356655, G01B 902

Patent

active

057813043

ABSTRACT:
Disclosed herein is an interferometric-based materials analysis system (10) that employs a novel combination of laser beam shaping and pointing techniques, the use of a low cost, rugged, and compact diode laser (22) as a detection laser, and the use of signal processing techniques that compensate for inherent instabilities and short-term drift in the diode laser. A matched filter processing technique is disclosed for processing interferometrically-obtained data points from a target being analyzed. The matched filter technique is shown to be especially useful for detecting and analyzing Lamb modes within thin targets, such as a silicon wafer undergoing a rapid thermal processing cycle.

REFERENCES:
patent: 5410405 (1995-04-01), Schultz et al.

Affiliated with

Also associated with

Rating

Laser ultrasonics-based material analysis system and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser ultrasonics-based material analysis system and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser ultrasonics-based material analysis system and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1887989