Laser ultrasonics-based material analysis system and method

Optics: measuring and testing – For light transmission or absorption

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Details

356359, 356655, G01B 902

Patent

active

057813043

ABSTRACT:
Disclosed herein is an interferometric-based materials analysis system (10) that employs a novel combination of laser beam shaping and pointing techniques, the use of a low cost, rugged, and compact diode laser (22) as a detection laser, and the use of signal processing techniques that compensate for inherent instabilities and short-term drift in the diode laser. A matched filter processing technique is disclosed for processing interferometrically-obtained data points from a target being analyzed. The matched filter technique is shown to be especially useful for detecting and analyzing Lamb modes within thin targets, such as a silicon wafer undergoing a rapid thermal processing cycle.

REFERENCES:
patent: 5410405 (1995-04-01), Schultz et al.

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