Laser trimming system for semiconductor integrated circuit chip

Details Laser trimming system for semiconductor integrated circuit chip Laser trimming system for semiconductor integrated circuit chip

1990-08-31

1992-03-24

Albritton, C. L.

Electric heating

Metal heating

By arc

21912167, 21912184, B23K 2600, B23K 2602

Patent

active

050991019

ABSTRACT:
An automatic laser trimming apparatus (30) for semiconductor integrated chip packages removes dambars (16) and performs deflashing and degating operations. The apparatus combines a laser machining subsystem (32, 36) with a machine vision subsystem (38, 40) to accurately locate and treat the dambars on an integrated circuit package. A defocusing lens (54) is used to attenuate the intensity of the laser beam (34) to permit a single laser to perform both the dambar removal and deflashing operations. In addition, an improved fixture (46) is provided to enhance the removal of smoke and debris from the processing station and to provide improved backlighting thereby enhancing resolution.

REFERENCES:
patent: 3696230 (1972-10-01), Friedrich
patent: 4467171 (1984-08-01), Ramos
patent: 4778693 (1988-10-01), Drozdowicz et al.
patent: 4801352 (1989-01-01), Piwczyk

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