Laser trim protection process and structure

Details Laser trim protection process and structure Laser trim protection process and structure

1979-06-04

1981-06-09

Edlow, Martin H.

Electric heating

Microwave heating

Tunnel furnace

357 4, 357 51, 357 22, 219121L, 219121LH, H01L 2714

Patent

active

042727758

ABSTRACT:
An element of an integrated circuit, such as an ion implanted region or a metal layer, may be laser trimmed without exposing P-N junctions or other circuit elements not to be trimmed to damage by the laser through use of the present protection process and structure. In the process, an oxide through which the laser trimming is carried out is formed over a selected portion of the circuit to be trimmed by the laser. A bare layer of a metal reflective to the laser radiant energy beam, such as aluminum, gold or silver, is formed surrounding the selected portion of the circuit. The selected portion of the integrated circuit is then trimmed with the laser. The oxide promotes trimming in the selected area by absorbing the laser radiant energy beam. The bare metal layer protects the portion of the integrated circuit underlying it by reflecting most of its energy.

REFERENCES:
patent: 4172741 (1979-10-01), Johnson
patent: 4190854 (1980-02-01), Redfern

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