Fishing – trapping – and vermin destroying
Patent
1990-09-26
1992-11-17
Nelson, Peter A.
Fishing, trapping, and vermin destroying
437985, H01L 2126
Patent
active
051643243
ABSTRACT:
A non-contact method to impart a texture to a surface using laser irradiation uses an excimer laser to illuminate a sample immersed in a halocarbon ambient thereby initiating a photo/thermal chemical reaction which etches the sample only in the area illuminated with sufficient laser fluence. The resulting etched area can be repetively illuminated and etched to provide a textured surface to reduce extraneous reflections, or for micromachining, decorative texturing and marking. This technique is particularly well suited to improve the performance of backside illuminated CCDs by reducing the background (dark) signal, increase resolution and responsivity uniformity. The technique is compatible with other laser processing procedures and can be implemented with a variety of CCD enhancements such as improved dark current and blue response from laser doping or activation of backside implants. The non-corrosive nature of the halocarbon ambients allows the laser texturing process to be performed on pre-packaged, pre-tested devices and therefore can salvage parts which had failed performance specifications. This process therefore can improve device performance as well as yield, reliability and fabrication costs.
REFERENCES:
patent: 4545823 (1985-10-01), Drowley
patent: 4865923 (1989-09-01), Ralston et al.
patent: 5061643 (1991-10-01), Yagi
Gutman, Halogen Chemistry, vol. 2, (New York; Academic Press, 1967) pp. 1189.
Winters et al., Surface Processes in Plaza-Assisted Etching Environments, J. Vac. Sci. Tech. B, vol. 1, (1983), p. 469.
Heath et al., Plasma Processing for VLSI, Academic Press, 1985, San Diego, pp. 487-502.
Osgood, Jr et al., Localized Laser Etching of Compound Semiconductors in Aqueous Solution, App. Phys. Lett., vol. 40, 1982, p. 391.
Russell et al., Excimer Laser-Assisted Etching of Si Using Chloropentafluoroethane, Mat. Res. Soc. Proc., vol. 158, 1990, pp. 325-330.
Mogyorosi et al., Laser-Induced Chemical Etching--Atmosphere: II II Cont. Irr., vol. 45, 293 (1988).
Ehrlich et al., A Review of Laser-Microchemical Processing, J. Vac. Sci. Tech. B, vol. 1, p. 969 (1983).
Houle, Basic Mechanisms in Laser Etching and Deposition, Appl. Phys. A, vol. 41, 315 (1986).
Bauerle, Chem. Processing with Lasers: Recent Developments, Appl. Phys. B, vol. 46, 261 (1988).
Chuang, Laser-Induced Chemical Etching--Challenges, Mat'3 ls Res. Soc. Symposia Proc., vol. 29, 1984, pp. 185-194.
von Gutfeld et al., Laser-Enhanced Etching--In KOH, App. Phys. Lett., vol. 40, 1982, p. 352.
Bunkin et al., Laser Control over Electrochemical Processes, SPIE vol. 473, Symposium OPTIKA '84, pp. 31-37.
Brunauer et al., Adsorption of Gases in Multimolecular Layers, J. Am. Chem. Soc., vol. 60, 1938, p. 309.
Gauthier et al., Mechanism Investigations--Induced Desorption, Phys. Stat. Sol. (A), vol. 38, 1976, p. 447.
Kullmer et al., Laser-Induced Chemical Etching--In Chlorine Atmosphere, I Pulsed Irr., vol. 45, 293 (1988).
Kullmer et al., Laser-Induced Chem. Etching--III Combined CW and Pulsed Irr., vol. 47, 377, (1988).
Horiike et al, Excimer-Laser Etching on Silicon, Appl. Phys. A, vol. 44, 313, (1987).
Chuang , Chlorine Surface Interaction and--Reactions, J. Vac. Sci. Tech. B, vol. 3, 1507 (1985).
Palmer et al., Laser-Induced Etching--by F.sub.2 /Ne, Conf. on Lasers--Series 1988, vol. 7, 284, Opt. Soc. of America.
Brannon, Chemical Etching of Silicon--Dissociation of NF.sub.3, Appl. Phys. A, vol. 46, 39 (1988).
Chuang, Infrared Laser Radiation Effects--with Silicon, J. Chem. Phys., vol. 74, 1461 (1981).
Houle, Photoeffects--Influence of Doping on Steady-State Phenomena, J. Chem. Phys., vol. 79, 4237, (1983).
Houle, Photoeffects--Response to Light, J. Chem. Phys., vol. 80, 4851 (1984).
Chuang, Multiple Photon Excited SF.sub.6 Interaction with Silicon Surfaces, J. Chem. Phys., vol. 74, 1453, 1981.
Armacost et al. 193 NM Excimer Laser-Assisted Etching of Polysilicon, Mat. Res. Soc. Symp. Proc., vol. 76, (1987), pp. 147-156.
Ehrlich et al., Laser-Induced Microscopic Etching of GaAs and InP, Appl. Phys. Lett., 36(8), Apr. 15, 1980.
Brewer et al., Photon-Assisted Dry Etching of GaAs, Appl. Phys. Lett., 45(4), Aug. 15, 1984.
Rytz-Froidevaux et al., Laser Generated Microstructures, Appl. Physl. A., vol. 37, 121-138 (1985).
Singer, Laser Planarized Metal. Shows Several Advantages, Semiconductor Int'l., vol. 13, No. 6, May 1990, pp. 18-20.
Kaminsky, Micromachining of Silicon Mechanical Structures, J. Vac. Sci. Technol. B, vol. 3, No. 4, Jul./Aug. 1985, pp. 1015-1024.
Kelley Eugene P.
Russell Stephen D.
Sexton Douglas A.
Fendelman Harvey
Keough
Nelson Peter A.
The United States of America as represented by the Secretary of
LandOfFree
Laser texturing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Laser texturing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser texturing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1171641