Laser system and method for selectively severing links

Details Laser system and method for selectively severing links Laser system and method for selectively severing links

1994-11-22

1995-12-05

Scott, Jr., Leon

Coherent light generators

Particular pumping means

372 25, 372 11, H01S 309

Patent

active

054736242

ABSTRACT:
A laser system and processing method exploits the absorption contrast between the materials from which a link (12) and an underlying substrate (22) are made to effectively remove the link from the substrate. Laser output in a wavelength range of 1.2 to 3 .mu.m (30) optimizes the absorption contrast between many materials (e.g., metals, polysilicon, polycides, or disilicides) and integrated circuit substrates (e.g., silicon, gallium arsenide, or other semiconductors) and permits the use of laser output in a wider range of energy or power levels, pulse widths, and spot sizes without risking damage to the substrates or adjacent circuit structures. Existing link processing laser systems can be readily modified to operate in the 1.2 to 3 .mu.m range.

REFERENCES:
patent: 4656635 (1987-04-01), Baer et al.
patent: 4731795 (1988-03-01), Clark et al.
patent: 4930901 (1990-06-01), Johnson et al.
patent: 4965803 (1990-10-01), Esterowitz et al.
patent: 5091991 (1992-02-01), Tulip
patent: 5265114 (1993-11-01), Sun et al.

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