Laser system and method for plating vias

Electric heating – Metal heating – By arc

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21912171, 21912185, 427555, 427597, 427 97, B23K 2600

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056141149

ABSTRACT:
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for plating internal wall surfaces (79, 126) of vias (72, 74) in multilayered electronic devices (80). The parameters of the output pulses (62) are selected to facilitate substantially uniform deposition of plating material particles explosively vaporized from a substrate (124) onto the internal wall surface (79, 126). These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz.

REFERENCES:
patent: 3562009 (1971-02-01), Cranston et al.
patent: 3632398 (1972-01-01), Konig
patent: 4059707 (1977-11-01), Smith et al.
patent: 4628174 (1986-12-01), Anthony
patent: 4659587 (1987-04-01), Imura et al.
patent: 4832788 (1989-05-01), Nemiroff
patent: 4915981 (1990-04-01), Traskos et al.
patent: 5034569 (1991-07-01), Gofuku et al.
patent: 5060595 (1991-10-01), Ziv et al.
patent: 5063280 (1991-11-01), Inagawa et al.
patent: 5073518 (1991-12-01), Doan et al.
patent: 5073687 (1991-12-01), Inagawa et al.
patent: 5087396 (1992-02-01), Zablotny et al.
patent: 5093279 (1992-03-01), Andreshak et al.
patent: 5108785 (1992-04-01), Lincoln et al.
patent: 5124780 (1992-06-01), Sandhu et al.
patent: 5153408 (1992-10-01), Handford et al.
patent: 5194713 (1993-03-01), Egitto et al.
patent: 5340947 (1994-09-01), Credle et al.
patent: 5378869 (1995-01-01), Marrs et al.
patent: 5492861 (1996-02-01), Opower
Pete Singer, "The Interconnect Challenge: Filling Small, High Aspects Ratio Contact Holes," Semiconductor International, Aug. 1994, pp. 57-64.
"Printed Circuit Operations--A View from Inside," Unisys.
Hans-Ulrich Krebs et al., "Pulsed laser deposition of thin metallic alloys," Appl. Phys. Lett., vol. 62, No. 19 (May 10, 1993), pp. 2341-2343.
Richard Harris et al., "MCM Micromachining: Nd:YAG UV Laser Process is a New Option," Electro Scientific Industries, Inc., Spring 1993.
"LaserPulse," Electro Scientific Industries, Inc., Fall 1993, pp. 1-7.
Y.S. Liu, "Laser Metal Deposition for High-Density Interconnect," Optics & Photonics News, Jun. 1992, pp. 10-14.
Friedrich G. Bachmann, "Large scale industrial application for excimer-lasers; via-hole-drilling by photo-ablation," SPIE, vol. 1361, Physical Concepts of Materials for Novel Optoelectronic Device Applications, 1990, pp. 500-511.
Vern Solberg, "PCMCIA Design Strategy: Adapting High Density SMT To Thin and Ultra-Thin Multilayer PC Boards," pp. 113-120.
"Dopant-Induced Excimer Laser Ablation of Poly(tetrafluoroethylene)," Applied Physics B: Photo-Physics and Laser Chemistry, Mar. 1992, vol. b54, No. 3, C R Davis et al, pp. 227-230.
"Etch-Stop Polymer Machining with an Argon Ion Laser," IBM Technical Disclosure Bulletin, Jan. 1993, vol. 36., No. 1, Armonk, NY, US, p. 254.
"Laser-Induced Plated Through-Holes," IBM Technical, Disclosure Bulletin, Oct. 1968, vol. 11, No. 5, H.R. Potts and C.A. Speicher, p. 540.

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