Laser soldering surface mount components of a printed circuit bo

Details Laser soldering surface mount components of a printed circuit bo Laser soldering surface mount components of a printed circuit bo

1993-06-04

1996-02-27

Hoang, Tu

Electric heating

Metal heating

By arc

21912161, 29840, B23K 2600

Patent

active

054950899

ABSTRACT:
This disclosure relates to a process for laser soldering surface mount components on a printed circuit board using the continuous wave laser scanning technique. The process involves factoring together the scan rate, the beam diameter, and the laser power level, in order to determine what these specific process variables should be. In addition, the process also involves taking account of the depth of a metallic layer, such as a reference plane, inside the printed circuit board to determine its effect on other process variables. On the other hand, if the board does not have a metallic layer, the process takes account of the thickness of the board being processed. Preferred ranges for process variables are identified, as well as optimization techniques which further refine the process variables to achieve production efficiency or bonding pull strength.

REFERENCES:
patent: 4792658 (1988-12-01), Langhans et al.
patent: 4854320 (1989-08-01), Dew et al.
patent: 4979290 (1990-12-01), Chiba
patent: 5008512 (1991-04-01), Spletter et al.
patent: 5193738 (1993-03-01), Hayes

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