Laser soldering method and apparatus

Details Laser soldering method and apparatus Laser soldering method and apparatus

1990-05-02

1991-06-04

Albritton, C. L.

Electric heating

Metal heating

By arc

219 8512, 21912178, B23K 2600

Patent

active

050216309

ABSTRACT:
An electronic device (10) is surface mounted to bonding pads (11) of a substrate (12) by first mounting the device within an aperture (24) of a glass plate (17). The leads (14) of the electronic device are coated with solder and pressed onto the bonding pads by the reusable glass plate (17). While pressing the plate against the leads, the plate is scanned with a laser beam (16) directly over each row of bonding pads. The laser light is of an appropriate wavelength such that the glass plate converts the laser light to heat, which melts the solder to bond the leads to the bonding pads.

REFERENCES:
patent: 3283124 (1966-11-01), Kawecki
patent: 3463898 (1969-08-01), Takaoka et al.
patent: 3586813 (1971-06-01), Cruickshank et al.
patent: 4785156 (1988-11-01), Benko et al.

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