Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1995-04-05
1997-01-21
Dang, Thi
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 39, 216108, H05K 300
Patent
active
055956688
ABSTRACT:
A process is provided for removing slag from an aperture in a substrate, comprising the steps of: providing a protective coating on the substrate; drilling a hole through the substrate; and chemically removing slag from the aperture by complete or partial immersion of the substrate into a chemical bath. Additional process steps can include cleaning the stripped substrate and baking the substrate at a high temperature. A base coating can be provided on the substrate to promote adhesion of a chemically resistant coating to the substrate. Additionally, a protective coating can be applied to the chemically resistant coating to protect it during drilling. The chemically resistant layer can be a material, such as gold, that does not oxidize or dissolve when it is exposed to a chemical, such as phosphoric acid. Phosphoric acid can be heated to accelerate slag removal.
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Knapp Christopher H.
Madden, Jr. Jean D.
Dang Thi
Electro-Films Incorporated
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