Laser separation of encapsulated submount

Details Laser separation of encapsulated submount Laser separation of encapsulated submount

2006-08-08

2006-08-08

Nguyen, Ha Tran (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S460000, C438S068000, C438S069000

Reexamination Certificate

active

07087463

ABSTRACT:
In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).

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patent: 6468821 (2002-10-01), Maeda et al.
patent: 6746889 (2004-06-01), Eliashevich et al.
patent: 2002/0028527 (2002-03-01), Maeda et al.
patent: 2003/0003690 (2003-01-01), Nering et al.
patent: 2002270901 (2002-09-01), None

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