Laser scoring of packaging substrates

Package making – Methods – Forming a cover adjunct or application of a cover adjunct to...

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Details

53452, 53455, 53469, B65B 6118, B65B 4304

Patent

active

056303084

ABSTRACT:
Packaging machinery alignment, and a package having tear initiation and tear control, result from laser scoring of the package substrate, particularly, by providing at least two substantially parallel, substantially straight or linear, laser scores across the entire width of such package substrate.

REFERENCES:
patent: 3124246 (1964-03-01), Remer et al.
patent: 3193978 (1965-07-01), Bader
patent: 3212381 (1965-10-01), Heyer
patent: 3234705 (1966-02-01), Schwartz
patent: 3874143 (1975-04-01), Braber
patent: 3909582 (1975-09-01), Bowen
patent: 4549063 (1985-10-01), Ang et al.
patent: 4586312 (1986-05-01), Limousin
patent: 4693365 (1987-09-01), Corella

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