Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-05-08
2007-05-08
Pezzuto, Robert E. (Department: 3766)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S083000, C439S876000, C439S909000, C607S036000, C607S037000
Reexamination Certificate
active
11004175
ABSTRACT:
A laser ribbon bond pad array connector is disclosed for electrically connecting a RF module to an IMD circuit board in an implantable medical device. The array connector includes a connector body with a plurality of electrically isolated bonding fingers embedded in the connector body. Each bonding finger includes a solder pad that is on a first surface of the connector body and a laser ribbon bond pad that is on a second surface of the connector body. The first and second surfaces are spaced apart in angular relations thereof.
REFERENCES:
patent: 3867950 (1975-02-01), Fischell
patent: 6459935 (2002-10-01), Piersma
patent: 6721602 (2004-04-01), Engmark et al.
patent: 6963780 (2005-11-01), Ruben et al.
Kronich Christine G.
Robinson Scott J.
Schaefer Todd H.
Chapik Daniel G.
Girma Wolde-Michael
Medtronic Inc.
Patel Natasha
Pezzuto Robert E.
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