Laser repair process for printed wiring boards

Details Laser repair process for printed wiring boards Laser repair process for printed wiring boards

1997-06-12

2000-04-04

Mills, Gregory

Electric heating

Metal heating

By arc

21912185, B23K 2600

Patent

active

060464291

ABSTRACT:
A method of repairing wiring shorts on a surface of an organic layer. The organic layer, which is preferably a SLC/ASM layer, may be a surface layer of a Printed Circuit (PC) board. The absorption spectrum of the organic layer is examined. Based on that absorption spectrum, a laser is selected with a wavelength such that the surface layer slightly absorbs, 1-10%, laser energy striking it. Thus, the laser removes metal on the surface, while slightly etching the surface layer and without effect on any metal buried in or beneath the surface layer. Preferably, the laser is an Nd:YAG laser having a wavelength in a range where the ASM layer absorption is between 2-5%, and the copper ablation rate is high.

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D.L. Klein, P.A. Leary-Renick & R. Srinivasan, Ablative Photodecomposition Process for Repair of Line Shorts, Feb. 1984, pp. 4669-4671.

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