Laser reflow soldering process with lead-tin solder pads

Details Laser reflow soldering process with lead-tin solder pads Laser reflow soldering process with lead-tin solder pads

1996-05-30

1998-04-21

Walberg, Teresa J.

Electric heating

Metal heating

By arc

21912184, 21912185, B23K 2612

Patent

active

057420254

ABSTRACT:
An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. One end of the cable includes lands proximate to through holes for soldered connection to pins which extend from the optical sub-assemblies. At the other end of the cable leads extend across interconnection pads on the surface of the rigid interconnect structure for soldered connection. The top surface of the interconnect pads is 10/90 (Sn/Pb) solder to provide a high temperature soldered joint. Solder flux can not be used because cleaning solvents would contaminate the interconnect structure. An atmosphere of formic acid mixed with nitrogen surrounds the lead and pad and a fluxless solder joint is formed by laser soldering.

REFERENCES:
patent: 3614832 (1971-10-01), Chance et al.
patent: 4018373 (1977-04-01), Beerwerth et al.
patent: 4435740 (1984-03-01), Huckabee et al.
patent: 4531044 (1985-07-01), Chang
patent: 4697061 (1987-09-01), Spaeter et al.
patent: 4894509 (1990-01-01), Chalco et al.
patent: 5005939 (1991-04-01), Arvanitakis et al.
patent: 5152450 (1992-10-01), Okikawa et al.
patent: 5194710 (1993-03-01), McDaniel et al.
patent: 5227604 (1993-07-01), Freedman

Affiliated with

Also associated with

Rating

Laser reflow soldering process with lead-tin solder pads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser reflow soldering process with lead-tin solder pads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser reflow soldering process with lead-tin solder pads will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2059916