Laser reflow soldering process and bonded assembly formed thereb

Details Laser reflow soldering process and bonded assembly formed thereb Laser reflow soldering process and bonded assembly formed thereb

1989-06-20

1990-05-15

Albritton, C. L.

Electric heating

Metal heating

By arc

21912164, B23K 2600

Patent

active

049260227

ABSTRACT:
A method of reflow soldering an electrical lead to a solder pad using a laser in which the solder pad, rather than the terminal, is irradiated by the laser beam. The pad becomes hot enough to melt the solder which efficiently transfers the thermal energy to the lead. Upon removal of the laser beam, the solder sets forming an intimate electrical and mechanical connection between the common areas of the lead and pad. To practice the process, the solder pad should extend out beyond the portion of the lead in contact with the pad by a distance equal to or exceeding the diameter of the laser beam used in the bonding process.

REFERENCES:
patent: 3402460 (1968-09-01), Smith
patent: 3610874 (1971-10-01), Gagliano
patent: 3718968 (1973-03-01), Sims et al.
patent: 3952180 (1976-04-01), Gnanamuthu
patent: 4404453 (1983-09-01), Gotman
patent: 4531044 (1985-07-01), Chang
patent: 4714815 (1987-12-01), Swarts et al.

Affiliated with

Also associated with

Rating

Laser reflow soldering process and bonded assembly formed thereb does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser reflow soldering process and bonded assembly formed thereb, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser reflow soldering process and bonded assembly formed thereb will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-622715