Laser processing method and processing device

Details Laser processing method and processing device Laser processing method and processing device

2008-07-22

2008-07-22

Evans, Geoffrey S (Department: 1793)

Electric heating

Metal heating

By arc

C219S121700, C219S121760

Reexamination Certificate

active

07402772

ABSTRACT:
Embodiments of the invention provide a laser processing apparatus and method. The laser processing apparatus includes a holder that holds a processing target, a first laser source that emits pulsed laser beam, and a second laser source that emits continuous-wave laser beam. The apparatus further includes an optical system that transmits the pulsed laser beam from the first laser source and the continuous-wave laser beam from the second laser source on a surface of the processing target held by the holder in such a manner that a beam spot of the pulsed laser beam is included inside a beam spot of the continuous-wave laser beam, and a moving mechanism that moves the beam spots of the pulsed laser beam and the continuous-wave laser beam on the surface of the processing target.

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Japanese Office Action dated Dec. 26, 2006 corresponding to application No. 2004-532781.
Japanese Office Action dated Mar. 18, 2008 with translation.

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