Laser processing method and laser processing apparatus

Details Laser processing method and laser processing apparatus Laser processing method and laser processing apparatus

1998-12-14

2000-12-05

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

438487, B23K 2600

Patent

active

061569976

ABSTRACT:
A device-forming region where a semiconductor device is formed is arranged on a substrate in the matrix of 2.times.2. A linear laser beam has a cross-section having a length longer than the width of the device-forming region. When the irradiation of the laser beam is performed, the region irradiated with the end portions of the linear laser beams overlapped with each other or brought into contact with each other, is made positioned outside the device-forming region.

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