Laser processing method and chip

Details Laser processing method and chip Laser processing method and chip

2010-01-15

2011-10-25

Garber, Charles (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C257SE21237

Reexamination Certificate

active

08043941

ABSTRACT:
An object to be processed can be cut highly accurately along a line to cut.An object to be processed1is irradiated with laser light while locating a converging point within a silicon wafer11, and the converging point is relatively moved along a line to cut5, so as to form modified regions M1, M2positioned within the object1along the line to cut5, and then a modified region M3positioned between the modified regions M1, M2within the object1.

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