Laser processing method and alignment

Details Laser processing method and alignment Laser processing method and alignment

1995-08-04

1997-07-01

Fourson, George

Fishing, trapping, and vermin destroying

437174, 148DIG90, 2504911, 2504922, B23K 2602, H01L 21268

Patent

active

056438010

ABSTRACT:
A laser processing process which includes laser annealing a silicon film 2 .mu.m or less in thickness by irradiating a laser beam 400 nm or less in wavelength and being operated in pulsed mode with a pulse width of 50 nsec or more and preferably, 100 nsec or more. The invention further relates to a laser processing apparatus which includes a laser generation device and a stage for mounting thereon a sample provide separately from said device, to thereby prevent transfer of vibration attributed to the movement of the stage to the laser generation device and the optical system. A stable laser beam can be obtained to thereby improve productivity.

REFERENCES:
patent: 4083272 (1978-04-01), Miller
patent: 4160263 (1979-07-01), Christy et al.
patent: 4249960 (1981-02-01), Schnable et al.
patent: 4328553 (1982-05-01), Fredrikson et al.
patent: 4370175 (1983-01-01), Levatter
patent: 4439245 (1984-03-01), Wu
patent: 4764485 (1988-08-01), Loughran et al.
patent: 4803528 (1989-02-01), Pankove
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4937618 (1990-06-01), Ayata et al.
patent: 5219786 (1993-06-01), Noguchi
patent: 5221365 (1993-06-01), Noguchi et al.
patent: 5313076 (1994-05-01), Yamazaki et al.
patent: 5372836 (1994-12-01), Imahashi et al.
patent: 5424244 (1995-06-01), Zhang et al.
"Laser Annealing of Semiconductors"; J.M. Poate (ed.) Epitaxy by Pulsed Annealing of Io-Implanted Silicon, Foti et al., (1982) Academic Press, pp. 203-245 1982.

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