Laser processing device

Details Laser processing device Laser processing device

2003-12-04

2009-02-10

Sugarman, Scott J (Department: 2873)

Optical: systems and elements

Lens

With light limiting or controlling means

C219S121750

Reexamination Certificate

active

07489454

ABSTRACT:
A laser processing apparatus which can suppress the positional fluctuation in light-converging point of laser light during laser processing is provided. On an optical path of laser light L1connecting a beam expander34and a first light-transmitting hole32of a lens holder29to each other in a laser processing apparatus20, a stop member38including a second light-transmitting hole39having the same diameter as that of the first light-transmitting hole32is disposed. Hence, the amount of laser light L1cut by the surrounding part of the first light-transmitting hole32can substantially be eliminated, whereby the lens holder29can be prevented from being heated upon irradiation with the laser light L1. Also, even when the stop member38is heated by the laser light L1cut by the surrounding part of the second light-transmitting hole39, heat is prevented from being transmitted from the stop member38to the lens holder29, since the stop member38is separated from the lens holder29. Therefore, the positional fluctuation in light-converging point P1of the laser light L1during laser processing can be suppressed to a low level.

REFERENCES:
patent: 4861964 (1989-08-01), Sinohara
patent: 6392683 (2002-05-01), Hayashi
patent: 7151788 (2006-12-01), Imakado et al.
patent: 2004/0002199 (2004-01-01), Fukuyo et al.
patent: 1 110 661 (2001-06-01), None
patent: 1 338 371 (2003-08-01), None
patent: 1087534 (1967-10-01), None
patent: 03-018979 (1991-01-01), None
patent: 05-212571 (1993-08-01), None
patent: 07-185862 (1995-07-01), None
patent: 08-099187 (1996-04-01), None
Kiyotaka Miura et al., “Formation of Photo-Induced Structures in Glasses with Femtosecond Laser”, Dai 42 Kai Proceedings of Laser Materials Processing Conference, Nov. 1997, pp. 105-111 (Including English-language abstract).
Ken-ichi Hayashi, “Inner Glass Marking by Harmonics of Solid State Laser”, Dai 45 Kai Proceedings of Laser Materials Processing Conference, Dec. 1998; pp. 23-28 (Including English-language abstract).
Tomokasu Sano et al., “Evolution of Processing Characteristics of Silicon With Picosecond Pulser Laser”, Osaka University, Graduate School, Department of Technological Research, Apr. 2000, pp. 72-73 (Including English-language translation).
Shuji Takaoka, “Stealth Dicing, Its Principles and Features: A Technology Most Suitable for Dicing Very Thin Semiconductor Wafers”, Sep. 2002, pp. 17-21 (Including English-language translation).

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