Laser processing apparatus and laser processing method

Details Laser processing apparatus and laser processing method Laser processing apparatus and laser processing method

2005-10-26

2009-11-24

Tadesse, Yewebdar T (Department: 1792)

Coating apparatus

Projection or spray type

C118S313000, C118S713000, C118S062000, C118S305000, C118S642000, C118S052000, C239S601000

Reexamination Certificate

active

07622000

ABSTRACT:
A notch or the like of a wafer is detected via a guide member by means of a CCD camera provided so that an optical axis is coaxial to an optical axis of a laser beam, and alignment of the wafer is carried out. Next, in a state in which liquid ejected from a main nozzle or sub-nozzles is guided by means of the guide member, a laser beam whose optical axis is provided to be coaxial to the optical axis of the CCD camera is irradiated via the guide member. In addition, a predetermined processing operation is carried out with respect to the surface while an irradiation position of the laser beam is moved in a horizontal direction. The wafer is then transported from a chuck to the outside, and then, a purge gas is supplied to a bottom face of the guide member, and the bottom face is dried.

REFERENCES:
patent: 2002/0136971 (2002-09-01), Ito et al.
patent: 2004/0197433 (2004-10-01), Terada et al.
patent: 2002-224878 (2002-08-01), None
patent: 2003-249427 (2003-09-01), None

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