Laser processing apparatus and laser processing method

Details Laser processing apparatus and laser processing method Laser processing apparatus and laser processing method

2011-06-28

2011-06-28

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S033000, C438S068000, C438S110000, C257S527000, C257SE21218, C257SE21508, C257SE23067

Reexamination Certificate

active

07968432

ABSTRACT:
A laser processing apparatus has one laser light source that simultaneously radiates laser beams with two wavelengths. Depth positions of focusing points for laser beams are gradually changed in a wafer. Three sets of modifying region groups, i.e., six layers of modifying region groups, are successively formed. One set of modifying region groups constitutes two layers and is formed at a time. The modifying region groups are separated, adjoined, or overlapped with each other along an estimated cut line of the wafer in a depth direction from a surface thereof.

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