Laser processing apparatus and laser processing method

Details Laser processing apparatus and laser processing method Laser processing apparatus and laser processing method

2011-04-05

2011-04-05

Elve, M. Alexandra (Department: 3742)

Electric heating

Metal heating

By arc

C219S121600, C219S121850

Reexamination Certificate

active

07919727

ABSTRACT:
A laser processing apparatus includes: a laser beam radiation part that radiates a laser beam to a target position on a substrate; a liquid supply source; a liquid supply nozzle that is connected to the liquid supply source through a liquid supply channel; a guide member for the ejected liquid; and a movement mechanism that allows a substrate holding part, and the laser beam radiation part, the guide member and the liquid supply nozzle to relatively move in a horizontal direction in a state that a center of a radiation spot of the laser beam is in a projection region on the substrate when the liquid ejection port of the liquid supply nozzle is extended in an ejection direction.

REFERENCES:
patent: 3991296 (1976-11-01), Kojima et al.
patent: 4752668 (1988-06-01), Rosenfield et al.
patent: 5496985 (1996-03-01), Foltz et al.
patent: 5902499 (1999-05-01), Richerzhagen
patent: 7021994 (2006-04-01), Ahti et al.
patent: 7622000 (2009-11-01), Koga et al.
patent: 7710582 (2010-05-01), Koga et al.
patent: 7728258 (2010-06-01), Richerzhagen et al.
patent: 3-254111 (1991-11-01), None
patent: 4-354321 (1992-12-01), None
patent: 2001-321977 (2001-11-01), None
patent: 2002-224878 (2002-08-01), None
patent: 2003-249427 (2003-09-01), None
patent: WO 99/56907 (1999-11-01), None

Affiliated with

Also associated with

Rating

Laser processing apparatus and laser processing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser processing apparatus and laser processing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser processing apparatus and laser processing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2634650