Laser processed coatings on electronic circuit substrates

Details Laser processed coatings on electronic circuit substrates Laser processed coatings on electronic circuit substrates

1992-12-08

1995-02-21

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361750, H05K 103

Patent

active

053918410

ABSTRACT:
Enhanced thermal and electrical properties of ceramic for high-power integrating substrates are provided by focused thermal energy sources such as by laser processing. A thin ceramic layer, such as alumina, is plasma spray deposited on a relative thick metal substrate, such as copper or alloy thereof, as a heat sink for improved dielectric and thermal properties which are produced by laser-reflow and recrystallization so as to convert and provide a different ceramic of higher dielectric and denser structure. Laser-reflow and recrystallization causes a purification or purging and conversion process that vaporizes deleterious impurities and changes the crystalline structure while densifying the resulting structure of the ceramic layer. After conversion of the ceramic layer a metal coating may be plasma spray deposited thereon and electrical circuit elements and wiring patterns may be formed thereon by laser etching for high power applications, such as heat-sinks, electronic control modules, or heating panels. As another aspect, ceramic coated metal substrates with recesses or cavities formed therein contiguous with its surfaces, may be laser-reflow processed for containing microelectronic circuit chips and devices in multilayer chip module (MCM) applications. Alternatively, ceramic substrates with cavities formed in the surfaces thereof may be laser-reflow processed for such multilayer applications.

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