Laser process for forming identically positioned alignment marks

Metal treatment – Compositions – Heat treating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29574, 29576B, 148187, 357 91, 427 531, H01C 700, H01L 21265, H01L 2166

Patent

active

045348049

ABSTRACT:
A laser beam is used to scribe an alignment mark on the back side of a lightly doped substrate of a silicon wafer containing an heavily doped internal layer. The wavelength of the laser beam is chosen such that it passes through the lightly doped substrate without absorption but is absorbed in the heavily doped internal layer to produce therein a defect which has the same position as the scribed alignment mark. Subsequent heating of the wafer causes the defect to migrate upwardly through a lightly doped epitaxial layer to the front side of the wafer and produce therein a visible mirror image of the scribed alignment mark.

REFERENCES:
patent: 3752589 (1973-08-01), Kobayashi
patent: 4046985 (1977-09-01), Gates
patent: 4131487 (1978-12-01), Pearce et al.
patent: 4137100 (1979-01-01), Zaleckas
patent: 4174217 (1979-11-01), Flatley
patent: 4217570 (1980-08-01), Holmes
patent: 4257827 (1981-03-01), Schwuttke et al.
patent: 4318752 (1982-03-01), Tien
patent: 4319119 (1982-03-01), Runge
patent: 4348809 (1982-09-01), Sasaki
patent: 4415373 (1983-11-01), Pressley

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Laser process for forming identically positioned alignment marks does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser process for forming identically positioned alignment marks, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser process for forming identically positioned alignment marks will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2316623

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.