Laser/pin assembly with integrated burn-in assembly

Details Laser/pin assembly with integrated burn-in assembly Laser/pin assembly with integrated burn-in assembly

1996-07-01

1997-04-01

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324766, G01R 3102, G01R 3128

Patent

active

056170360

ABSTRACT:
A burn-in assembly is disclosed having a substrate on which devices to be tested are die and wire bonded. Circuitry for effecting the burn-in testing is connected to the devices under test, and after testing is complete, the substrate is diced into individual optical submounts for packaging.

REFERENCES:
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patent: 4897711 (1990-01-01), Blonder et al.
patent: 4961053 (1990-10-01), Krug
patent: 5268635 (1993-12-01), Bortolini et al.
patent: 5357103 (1994-10-01), Sasaki
patent: 5371352 (1994-12-01), Yoshida
patent: 5479426 (1995-12-01), Nakanishi et al.
Electronic Letters "Self-Aligned Flat-Pack Fibre-Photodiode Coupling"; Jul. 1988; vol. 24; No. 15.
IEEE Transactions On Components, Hybrids And Manufacturing Technology; "Gigabit Transmitter Array Modules on Silicon Waferboard"; Craig A. Armiento; vol. 15; No. 6; Dec. 1992.
"1995 Proceedings 45th Electronic Components & Technology Conference - May 21-May 24, 1995"; pp. 841-845.

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