Chemistry: electrical and wave energy – Processes and products – Processes of treating materials by wave energy
Patent
1984-03-12
1985-07-16
Williams, Howard S.
Chemistry: electrical and wave energy
Processes and products
Processes of treating materials by wave energy
210748, 422 22, B01J 1912
Patent
active
045294895
ABSTRACT:
A CW tunable laser is employed in a laser photochemical decomposition met to achieve decomposition of a compound of high toxicity to relatively non-toxic decomposition products.
Organophosphorus chemical agents containing a characteristic C--O--P group are irradiated with a predetermined power level from about 10 to about 150 W/cm.sup.2 for a predetermined time period to effect cleavage of the C--O bond. The infrared laser excitation level of radiation in the range of 10.4 .mu.m or 9.4 .mu.m is resonant with the absorption band of the C--O--P group contained in the organophosphorus chemical agent. The absorbed radiation effects cleavage of the C--O bond and thereby achieves decomposition of the organophosphorus chemical agent.
The disclosed method is highly selective for cleavage of the C--O bond rather then cleavage of the P--O bond, and in the presence of air, the method requires low power levels of the CO.sub.2 laser for rapid and complete dissociation of the organophosphorus chemical agent.
REFERENCES:
patent: 4124466 (1978-11-01), Morrey
patent: 4303483 (1981-12-01), Ham et al.
McDonald Joseph K.
Merritt James A.
Stanley Ann E.
Gibson Robert P.
Lane Anthony T.
The United States of America as represented by the Secretary of
Voigt Jack W.
Williams Howard S.
LandOfFree
Laser photochemical decomposition of compounds containing R--O-- does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Laser photochemical decomposition of compounds containing R--O--, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser photochemical decomposition of compounds containing R--O-- will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1734501