Laser OLB apparatus and method of mounting semiconductor device

Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system

Patent

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Details

21912183, 21912164, G01N 2186

Patent

active

053592034

ABSTRACT:
A laser OLB apparatus includes an XY table; a bonding laser source for irradiating bonding parts between bonding lands of a substrate and leads of a semiconductor device located on the substrate thereby bonding the bonding parts; a recognition device for recognizing whether the leads of the semiconductor device are free of flexure and deviation; and a control unit for controlling the XY table and the laser source so that bonding is conducted only when the recognition device has recognized that the leads are free of flexure and deviation.

REFERENCES:
patent: 5008512 (1991-04-01), Spletter et al.
patent: 5168141 (1992-12-01), Tosjian et al.

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