Electric heating – Metal heating – By arc
Reexamination Certificate
2005-11-29
2005-11-29
Evans, Geoffrey S. (Department: 1725)
Electric heating
Metal heating
By arc
C219S121860
Reexamination Certificate
active
06969822
ABSTRACT:
The described embodiments relate to laser micromachining a substrate. One exemplary embodiment includes a chamber configured to receive an assist gas from an assist gas source. The chamber is configured to allow a laser beam to pass through the chamber to contact a substrate positioned outside of the chamber. The laser machine also includes a nozzle plate positioned in gas receiving relation with the chamber, the nozzle plate having at least one nozzle opening formed therein, wherein the at least one nozzle opening is substantially coincident a footprint of a feature desired to be formed in the substrate.
REFERENCES:
patent: 2841477 (1958-07-01), Hall
patent: 3364087 (1968-01-01), Raymond
patent: 3571555 (1971-03-01), Townes
patent: 3866398 (1975-02-01), Vernon, Jr. et al.
patent: 4027137 (1977-05-01), Liedtke
patent: 4227582 (1980-10-01), Price
patent: 4260649 (1981-04-01), Dension et al.
patent: 4331504 (1982-05-01), Chuang et al.
patent: 4332999 (1982-06-01), Wittke
patent: 4467168 (1984-08-01), Morgan et al.
patent: 4532401 (1985-07-01), Shiozaki et al.
patent: 4643799 (1987-02-01), Tsujii et al.
patent: 4731158 (1988-03-01), Brannon
patent: 4801352 (1989-01-01), Piwczyk
patent: 4913405 (1990-04-01), Van Der Have et al.
patent: 4925523 (1990-05-01), Braren et al.
patent: 5164324 (1992-11-01), Russell et al.
patent: 5266532 (1993-11-01), Russell et al.
patent: 5322988 (1994-06-01), Russell et al.
patent: 5328517 (1994-07-01), Cates et al.
patent: 5345057 (1994-09-01), Muller
patent: 5348609 (1994-09-01), Russell et al.
patent: 5354420 (1994-10-01), Russell et al.
patent: 5362450 (1994-11-01), Russell et al.
patent: 5385633 (1995-01-01), Russell et al.
patent: 5387314 (1995-02-01), Baughman et al.
patent: 5443033 (1995-08-01), Nishizawa et al.
patent: 5451378 (1995-09-01), Russell et al.
patent: 5493445 (1996-02-01), Sexton et al.
patent: 5501893 (1996-03-01), Laermer et al.
patent: 5504301 (1996-04-01), Eveland
patent: 5531857 (1996-07-01), Engelsberg et al.
patent: 5591285 (1997-01-01), Afzali-Ardakani et al.
patent: 5608436 (1997-03-01), Baughman et al.
patent: 5643472 (1997-07-01), Engelsberg et al.
patent: 5669979 (1997-09-01), Elliott et al.
patent: 5688715 (1997-11-01), Sexton et al.
patent: 5716495 (1998-02-01), Butterbaugh et al.
patent: 5739502 (1998-04-01), Anderson et al.
patent: 5760368 (1998-06-01), Nakata
patent: 5814156 (1998-09-01), Elliott et al.
patent: 5818009 (1998-10-01), Nakata et al.
patent: 5869803 (1999-02-01), Noguchi et al.
patent: 5874011 (1999-02-01), Ehrlich
patent: 5877392 (1999-03-01), Russell et al.
patent: 5898522 (1999-04-01), Herpst
patent: 5912186 (1999-06-01), Yishino et al.
patent: 5935464 (1999-08-01), Dulaney et al.
patent: 5986234 (1999-11-01), Matthews et al.
patent: 6008144 (1999-12-01), Shih et al.
patent: 6074957 (2000-06-01), Donohoe et al.
patent: 6136096 (2000-10-01), Morishige
patent: 6144010 (2000-11-01), Tsunemi et al.
patent: 6204475 (2001-03-01), Nakata et al.
patent: 6284148 (2001-09-01), Laermer et al.
patent: 6331258 (2001-12-01), Silverbrook
patent: 6335507 (2002-01-01), Nakata et al.
patent: 6339205 (2002-01-01), Nakayama
patent: 6376797 (2002-04-01), Piwczyk et al.
patent: 6384371 (2002-05-01), Hinei et al.
patent: 6400389 (2002-06-01), Shaffer et al.
patent: 6423928 (2002-07-01), Piwczyk
patent: 6448534 (2002-09-01), Kobsa
patent: 6472295 (2002-10-01), Morris et al.
patent: 2002/0017514 (2002-02-01), Lambert
patent: 2002/0040894 (2002-04-01), Borstel
patent: 2002/0086544 (2002-07-01), Boyle
patent: 2002/0088780 (2002-07-01), Boyle et al.
patent: 2002/0108938 (2002-08-01), Patel
patent: 2002/0130116 (2002-09-01), Lawson
patent: 2002/0170891 (2002-11-01), Boyle et al.
patent: 2003/0062126 (2003-04-01), Scaggs
patent: 2 342 883 (2000-04-01), None
patent: WO96/06694 (1996-03-01), None
patent: WO 01/10177 (2001-02-01), None
patent: WO 02/34455 (2002-05-01), None
patent: WO 02/47863 (2002-06-01), None
patent: WO 02/076666 (2002-10-01), None
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