Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2007-11-27
2007-11-27
Kosowski, Alexander (Department: 2125)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S159000, C264S400000, C219S121600, C219S121700
Reexamination Certificate
active
10832034
ABSTRACT:
A method of laser machining a fluid path is provided. The method comprises directing a first laser toward a first surface, directing a second laser toward a second surface of the substrate, and directing a third laser toward the second surface along at least a portion of an edge of an area that defines a portion of the fluid path on the second surface.
REFERENCES:
patent: 4555610 (1985-11-01), Polad et al.
patent: 4737613 (1988-04-01), Frye
patent: 6037103 (2000-03-01), Hino
patent: 6407363 (2002-06-01), Dunsky et al.
patent: 6423934 (2002-07-01), Hasegawa et al.
patent: 6448534 (2002-09-01), Kobsa
patent: 6512198 (2003-01-01), Eisele et al.
patent: 6610960 (2003-08-01), De Steur et al.
patent: 6676878 (2004-01-01), O'Brien et al.
patent: 6689985 (2004-02-01), Lipman et al.
patent: 2002/0149136 (2002-10-01), Baird et al.
patent: 2002/0170891 (2002-11-01), Boyle et al.
patent: 2003/0213787 (2003-11-01), Dunsky et al.
patent: 2004/0017428 (2004-01-01), Cronin et al.
patent: 2005/0189331 (2005-09-01), Millard et al.
patent: 1187698 (2004-03-01), None
patent: WO 03/070415 (2003-08-01), None
patent: WO 03/079669 (2003-09-01), None
Doran John
Jordan Rory
Scott Graeme
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