Laser micromachining method

Details Laser micromachining method Laser micromachining method

2007-12-04

2007-12-04

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S460000, C257SE21001

Reexamination Certificate

active

10985572

ABSTRACT:
A laser micromachining method is disclosed wherein a workpiece is milled using an incident beam from a laser beam focused above the surface of the workpiece. The incident beam is guided by a plasma channel generated by the incident beam. The plasma channel, which has a relatively constant diameter over an extended distance, is generated by continual Kerr effect self-focusing balanced by ionization of air beam defocusing.

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Tzortzakis, S. et al, “Long Connected Plasma Channels in Air Produced by Ultrashort UV Laser Pulses,” Quantum Electronics and Laser Science Conference (QELS 2000), San Francisco, CA, May 7-12, 2000, pp. 143-144.
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Shah, Lawrence et al., “Self-Focusing During Femtosecond Micromachining of Silicate Glasses,” IEEE Journal of Quantum Electronics, vol. 40, No. 1, Jan. 2004, pp. 57-68.
La Fontaine, B. et al., “Filamentation of Ultrashort Pulse Laser Beams Resulting from their Propagation Over Long Distances in Air,” Physics of Plasmas, vol. 6, No. 5, May 1999, pp. 1615-1621.
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